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GT810 Die Bonding System

  • GT810 Die Bonding System
GT810 Die Bonding System

GT810 Die Bonding System

  • Product description: Automatic Die bonding system, high efficiency, high precision, CCD detection and positioning
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  • Nitrogen oven
  • 6inch, 8inch wafer handling
  • UPH>40K/Hour
  • MTBA>30min,MTBF>100hour
  • Power: 220V@40KW
  • Nitrogen: 15m3/hr,@3kg/cm2
  • Gas pressure: 5kg/cm2

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