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GT630 Die Bonding System
GT630 Die Bonding System
Product description: Four-head Four-arm swing arm blue film crystal, high efficiency, high precision, CCD detection and positioning
INQUIRY
Customized Nitrogen vacuum oven,Void detection process
8inch,12inch wafer handling
Multi-die bonding
UPH>60K/Hour
MTBA>30min,MTBF>100hour
Power: 220V@60KW
Nitrogen: 15m3/hr,@3kg/cm2
Void Rate<5%
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