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GT820 Clip System
GT820 Clip System
Product description: Automatic Die bonding system, high efficiency, high precision, CCD detection and positioning
INQUIRY
Automatic clip bonding system,vacuum sintering
8inch wafer handling
UPH>30K/Hour
MTBA>30min,MTBF>100hour
Power: 220V@60KW
Nitrogen: 15m3/hr,@3kg/cm2
Gas pressure: 5kg/cm2
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GT830 Ceramic Die Bonding
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GT830 Ceramic Die Bonding
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GT880 Clip System
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