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GS385 Multi-Function Bonding System
GS385 Multi-Function Bonding System
Product description: Leading throughput,Enhanced manufacturing area efficiency,Capable of high density lead frame handling
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2nd Generation micro pick-place technology,more powerful and more accurate
high performance direct motion system, 0.1mm die handling capability
High-density leadframe handling with universal workholder design
Ultra small dot dispensing capability
Capable of ultra-small dice handling
Dual dispensing system
Multi-die bonding,Capable of AB dice handling
8inch,12inch wafer handling
DAF/STACK die attach support
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GS260 Soft Solder System
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GT630 Die Bonding System
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