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GS260 Soft Solder System
GS260 Soft Solder System
Product description: Leading throughput,Enhanced manufacturing area efficiency,Capable of high density lead frame handling
INQUIRY
Multi-angle bonding,Flux eutectic / epoxy bonding
6inch,8inch wafer handling
UPH>12K/Hour
Power: 220V@2KW
Vacuum negative pressure: ≦80Kpa
Void Rate<5%
Accuracy：±0.02mil
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GS385 Multi-Function Bonding System
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